In 2025, the domestic anti-static blister packaging market surpassed RMB 12 billion, maintaining a compound annual growth rate above 12% over the past five years. With the expanding production capacity of 3C electronics, new energy vehicles, and smart terminal manufacturing, anti-static blister trays — serving as critical protective carriers for chips and electronic component tape reels — have been upgraded from optional accessories to essential requirements. High-end anti-static trays can stably maintain surface resistance at 10⁶-10⁹ Ω, with dimensional tolerances controlled within ±0.1mm, meeting the stringent requirements of semiconductor packaging and wafer transportation.

A number of enterprises with full industry chain capabilities have emerged in the sector, with manufacturers such as A company in Dongguan achieving independent control across the entire chain from material modification R&D to dust-free production. As the domestic semiconductor industry rises, the localized supply capacity of high-precision anti-static blister trays continues to strengthen, accelerating the import substitution process.